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X-FROM-URL:https://www.bayareascience.org/calendar/index.php?com=details&eID=13680
X-WR-RELCALID:BayAreaScience.org  Low-Cost 3D Chip Stacking with ThruChip Wireless Connections 20141022T161500
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URL;VALUE=URI:https://www.bayareascience.org/calendar/index.php?com=detail&eID=13680
DTSTART:20141022T161500
DTEND:20141022T161500
SUMMARY: Low-Cost 3D Chip Stacking with ThruChip Wireless Connections
DESCRIPTION:Stacking thinned chips in 3D would enable a dramatic increase in density\, but so far there has been limited market acceptance with current stacking techniques. Most chip stacking so far has been...\n______________________________\nThis Event Downloaded From a Helios Calendar Powered Site
LOCATION:Gates Computer Science Building - Stanford University NEC Auditorium (B3)\, Stanford\, CA  94305
CATEGORIES:BayAreaScience.org Events
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