Engineering Heterogeneous Materials and Devices for 3D-Integrated Energy-Efficient Electronics

With the rise in global data demands, energy efficiency in electronics has become a defining challenge for sustainable progress in AI, healthcare, IoT, and beyond. Today’s electronics, constrained by materials and architectures that separate computing and memory, are nearing their energy and latency limits for data-intensive applications. Emerging approaches, such as neuro-inspired computing and 3D integration of logic and memory devices, offer great promise; realizing these advances, however, requires innovations in materials, transport physics, device engineering, and thermal management. In this talk, I will discuss how atomic-scale engineering and integration of heterogeneous materials and devices can address these intertwined challenges with an emphasis on (1) engineering heterostructures for low-power memory and high-frequency logic, (2) new materials for low-resistance interconnects, and (3) thermal management strategies. I will conclude the talk by sharing my vision for advancing transformative materials and multifunctional nanodevices to drive the future of 3D-integrated, energy-efficient electronics.

Speaker: Asir Kahn, UC Berkeley